HighSpeed & Microwave PCB

Radio frequency and microwave PCB’s are a kind of PCB designed to operate on signals in the megahertz to gigahertz frequency ranges. These frequency ranges are used for communication signals in everything from cellphones to military radars. The materials used to construct these PCB’s are advanced composites with especial characteristics for dielectric constant (Dk), dissipation factor (Df), and CTE (co-efficient of thermal expansion).

High frequency circuit materials with a low value and stable Dk and loss tangent allow for high speed signals to travel through the PCB with less impedance than standard FR-4 PCB materials.  These materials can be mixed in the same Stack-Up for optimal performance and economics.

The advantages of using materials with a low X, Y and Z CTE is a resulting PCB structure that will remain extremely stable in high temperature environments while operating at up to 40 GHz in analog and digital high speed applications. This allows for the effective placement of very fine pitch components.  Additionally, the low CTE materials will facilitate the alignment of multiple layers and the features they represent in a complex PCB Layout.