Inelso invites to visit our stand 5-300 at SMT Hybrid Packaging 2018

We kindly invite you and your company to visit us at SMT Hybrid Packaging 2018 in Messe Nuremberg in June 5-7.

We are pleased to update you on the latest trends and developments of the market.

SMT Hybrid Packaging is the only event in Europe which takes a comprehensive view of System integration in microelectronics, from the initial idea and its development right through to the production of all technical processes during the manufacture of electronic assemblies.

We are looking forward to meeting you at our Booth 5-300 (Hall 5) to offer you friendly discussion and a cup of coffee.

 Wishing you every success and hoping to meet you there!

HERE You can receive the personal free voucher.